Full Text:   <2501>

CLC number: TN304.055

On-line Access: 

Received: 1999-10-12

Revision Accepted: 2000-05-15

Crosschecked: 0000-00-00

Cited: 1

Clicked: 5369

Citations:  Bibtex RefMan EndNote GB/T7714

-   Go to

Article info.
Open peer comments

Journal of Zhejiang University SCIENCE A 2000 Vol.1 No.4 P.427-430

http://doi.org/10.1631/jzus.2000.0427


AN ULTRAHIGH VACUUM CHEMICAL VAPOR DEPOSITION SYSTEM AND Si, GeSi EPITAXY ON A THREE-INCH Si WAFER


Author(s):  HUANG Jing-yun, YE Zhi-zhen, LU Huan-ming, ZHAO Bing-hui, WANG Lei, QUE Duan-lin

Affiliation(s):  State Key Laboratory of Silicon Materials, Zhejiang University, Hangzhou, 310027

Corresponding email(s):   silab@cmsce.zju.edu.cn

Key Words:  UHV/CVD, silicon, germanium-silicon, epitaxy


Share this article to: More

HUANG Jing-yun, YE Zhi-zhen, LU Huan-ming, ZHAO Bing-hui, WANG Lei, QUE Duan-lin. AN ULTRAHIGH VACUUM CHEMICAL VAPOR DEPOSITION SYSTEM AND Si, GeSi EPITAXY ON A THREE-INCH Si WAFER[J]. Journal of Zhejiang University Science A, 2000, 1(4): 427-430.

@article{title="AN ULTRAHIGH VACUUM CHEMICAL VAPOR DEPOSITION SYSTEM AND Si, GeSi EPITAXY ON A THREE-INCH Si WAFER",
author="HUANG Jing-yun, YE Zhi-zhen, LU Huan-ming, ZHAO Bing-hui, WANG Lei, QUE Duan-lin",
journal="Journal of Zhejiang University Science A",
volume="1",
number="4",
pages="427-430",
year="2000",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.2000.0427"
}

%0 Journal Article
%T AN ULTRAHIGH VACUUM CHEMICAL VAPOR DEPOSITION SYSTEM AND Si, GeSi EPITAXY ON A THREE-INCH Si WAFER
%A HUANG Jing-yun
%A YE Zhi-zhen
%A LU Huan-ming
%A ZHAO Bing-hui
%A WANG Lei
%A QUE Duan-lin
%J Journal of Zhejiang University SCIENCE A
%V 1
%N 4
%P 427-430
%@ 1869-1951
%D 2000
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.2000.0427

TY - JOUR
T1 - AN ULTRAHIGH VACUUM CHEMICAL VAPOR DEPOSITION SYSTEM AND Si, GeSi EPITAXY ON A THREE-INCH Si WAFER
A1 - HUANG Jing-yun
A1 - YE Zhi-zhen
A1 - LU Huan-ming
A1 - ZHAO Bing-hui
A1 - WANG Lei
A1 - QUE Duan-lin
J0 - Journal of Zhejiang University Science A
VL - 1
IS - 4
SP - 427
EP - 430
%@ 1869-1951
Y1 - 2000
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.2000.0427


Abstract: 
An ultrahigh vacuum chemical vapor deposition (UHV/CVD) system with reflection high energy electron diffraction (RHEED) was introduced. The Si epilayers and SiGe strained-layers on three-inch Si (100) substrates were grown in this UHV/CVD system. The substrate temperature during growth was from 550°C to 780°C. The properties of epilayers were characterized by high-resolution cross-sectional transmission electron microscopy (TEM), double crystal X-ray diffraction (DCXRD), and spreading resistance (SPR). A B-doped SiGe epilayer with uniform resistivity distribution was grown.

Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article

Reference

[1]Hu, S. M., Schmidt, S., 1968. Interactions in sequential diffusion processes in semiconductors. J. Appl. Phys., 39:4272-4282.

[2]Huang, J., Ye, Z., Lu, H. et al., 1998. Calculation of Critical Layer Thickness Considering Thermal Strain in Si1-xGex/Si Strain-layer Heterostructur. J. Appl. Phys., 83:171-173.

[3]Ismail, . K., Meyerson B. S., Wang, P. J., 1991. High electron mobility in moduiation-doped Si/SiGe. Appl. Phys. Lett., 58:2117-2119.

[4]Mooney, P. M., LeGoues, F. K., Chu, J. O. et al., 1993. Strain relaxation and mosaic structure in relaxed SiGe layers. Appl. Phys. Lett., 62: 3463-3465.

[5]Meyerson, B. S., 1986. Low temperature silicon epitaxy by ultra-high vacuum chemical vapor deposition. Appl. Phys. Lett., 48:797-799.

[6]Meyerson, B. S., Himpsel, F. J., and Uram K. J., 1990. Bistable conditions for low temperature silicon epitaxy. Appl. Phys. Lett., 57:1034-1036.

[7]Meyerson, B. S., 1992. UHV/CVD growth of Si and Si:Ge alloys: chemistry, physics, and device applications. Proceedings of the IEEE, 80:1592-1608.

[8]Patton, G. L, Comfort, J. H., Meyerson, B. S. et al., 1990. 75 GHz fT SiGe-base heterojunction bipolar transistors. Electron. Device Lett., 11:171-173.

[9]People, R., 1986. Physics and application of Ge1-xSix/Si strained-layer heterostructure. IEEE. J. Quantum Electronics, QE22:1696.

[10]Racanelli, M., Greve, D. W., 1990. Temperature dependence of growth of GexSi1-x by ultrahigh vacuum chemical vapor deposition. Appl. Phys. Lett., 56:2524-2526.

[11]Ye, Z., Liu, Y., Zhou, Z. et al., 1993. Structural characterization of low temperature epi-silicon grown on (100) and (111) Si substrates using ultrahigh resolution cross-sectional TEM. Journal of Electron Materials, 22: 247-251.

[12]Ye, Z., Jiang, X., Yuan, J. et al., 1996. Optimization of Si wafer chemical cleaning process. Ch. J. of Semiconductors, 17(5):380-385.

Open peer comments: Debate/Discuss/Question/Opinion

<1>

Please provide your name, email address and a comment





Journal of Zhejiang University-SCIENCE, 38 Zheda Road, Hangzhou 310027, China
Tel: +86-571-87952783; E-mail: cjzhang@zju.edu.cn
Copyright © 2000 - 2024 Journal of Zhejiang University-SCIENCE