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Frontiers of Information Technology & Electronic Engineering

ISSN 2095-9184 (print), ISSN 2095-9230 (online)

On-chip optical interconnect using visible light

Abstract: We propose and fabricate a monolithic optical interconnect on a GaN-on-silicon platform using a wafer-level technique. Because the InGaN/GaN multiple-quantum-well diodes (MQWDs) can achieve light emission and detection simultaneously, the emitter and collector sharing identical MQW structure are produced using the same process. Suspended waveguides interconnect the emitter with the collector to form in-plane light coupling. Monolithic optical interconnect chip integrates the emitter, waveguide, base, and collector into a multi-component system with a common base. Output states superposition and 1×2 in-plane light communication are experimentally demonstrated. The proposed monolithic optical interconnect opens a promising way toward the diverse applications from in-plane visible light communication to light-induced artificial synaptic devices, intelligent display, on-chip imaging, and optical sensing.

Key words: Homogeneous integration, Multiple-quantum-well diode, Visible light interconnection, Coexistence of light emission and photodetection

Chinese Summary  <21> 同质集成可见光互联芯片

概要:本文采用晶圆级微纳加工技术,基于硅衬底氮化镓晶圆,提出并制备了同质集成发射极、集电极和基极的可见光互联芯片。利用InGaN/GaN量子阱二极管器件发光探测共存的特性,芯片的发射极和集电极采用相同的量子阱结构,并通过相同的制备工艺实现。发射极和集电极之间通过悬空的光波导连接,实现器件之间的光互联。同质集成可见光互联芯片集成两个共基极的光致晶体管,实现芯片内可见光的发射、传输和探测功能。该可见光互联芯片可以广泛应用于光致类脑神经形态芯片、芯片内可见光通信、智能显示、微纳成像及光传感等领域。

关键词组:同质集成;量子阱二极管;可见光互联;发光探测共存现象


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DOI:

10.1631/FITEE.1601720

CLC number:

TN491; E963

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On-line Access:

2017-10-25

Received:

2016-11-18

Revision Accepted:

2017-03-14

Crosschecked:

2017-09-30

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