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Frontiers of Information Technology & Electronic Engineering

ISSN 2095-9184 (print), ISSN 2095-9230 (online)

2019 Vol.20 No.4 P.472-480

Heterogeneous III-V silicon photonic integration: components and characterization

Shang-jian Zhang, Yong Liu, Rong-guo Lu, Bao Sun, Lian-shan Yan

School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China; Center for Information Photonics and Communications, School of Information Science and Technology, Southwest Jiaotong University, Chengdu 610031, China

sjzhang@uestc.edu.cn, yongliu@uestc.edu.cn

Abstract: Heterogeneous III-V silicon (Si) photonic integration is considered one of the key methods for realizing power and cost-effective optical interconnections, which are highly desired for future high-performance computers and datacenters. We review the recent progress in heterogeneous III-V/Si photonic integration, including transceiving devices and components. We also describe the progress in the on-wafer characterization of photonic integration circuits, especially on the heterogeneous III-V/Si platform.

Key words: Heterogeneous photonic integration, Optical interconnection, On-wafer characterization

Chinese Summary  <20> III-V/Si异质光子集成：组件及其特性

摘要：III-V/Si异质光子集成被视为实现能源效率和成本效率的光互连关键技术之一，在未来高性能计算机和数据中心有极大潜力。本文综述了包括收发器件和组件的III-V/Si异质光子集成的最新研究进展，并报告了在光子集成回路，特别是异质集成平台上实现光子集成回路的晶圆级测试分析进展。

关键词组：异质光子集成；光互连；晶圆级测试分析


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DOI:

10.1631/FITEE.1800482

CLC number:

O439

Download Full Text:

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On-line Access:

2019-05-14

Received:

2018-08-11

Revision Accepted:

2018-12-02

Crosschecked:

2019-04-11

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