Abstract: Thermal analysis and thermal diagnose are important for small power connector especially in electronic devices since their structure is usually compact. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and that increased contact resistance produced more Joule heating; this mutual action causes the connector to lose efficiency. The thermal distribution in the connector was analyzed using finite element method (FEM). The failure mechanism is discussed. It provides basis for improving the structure. The conclusion was verified by experimental results.

Key words: Connector, Stress relaxation, Finite element method (FEM), Thermal failure

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