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Frontiers of Information Technology & Electronic Engineering
ISSN 2095-9184 (print), ISSN 2095-9230 (online)
2016 Vol.17 No.1 P.67-73
Antenna-in-package system integrated with meander line antenna based on LTCC technology
Abstract: We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.
Key words: Antenna-in-package (AiP), Meander line antenna, Multi-chip module (MCM), Low temperature co-fired ceramic (LTCC)
创新点：设计了一种曲折线天线结构用以实现系统的小型化。在封装层腔体内引入一种叠层多芯片组件结构，提高了整体集成度。通过添加通孔及馈线结构减少天线与封装层内部芯片间的电磁耦合。
方法：首先，基于LTCC的材料特性及设计的性能需要，设计一种曲折线形天线，并对其原理进行分析，对其回波损耗特性进行仿真（图3）。然后，针对封装天线集成电路芯片的需要，提出一种LTCC材料的多芯片组件结构（图8），同时在封装层内加入一定数量的金属通孔（图9），以减少天线与芯片间的电磁耦合。最后，将上述设计的天线与封装层结构整合在一起，并进行实际制作（图12），通过测试得到制作的封装天线系统的方向特性图（图13）和回波损耗特性曲线（图14）。
结论：针对2.4 GHz频段的应用需要，提出了一种小型化高集成度的封装天线结构。该结构满足实际应用所需的性能指标，且能方便地通过LTCC工艺实现。
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DOI:
10.1631/FITEE.1500167
CLC number:
TN82
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On-line Access:
2016-01-05
Received:
2015-05-20
Revision Accepted:
2015-07-09
Crosschecked:
2015-12-08