CLC number: TB114.3; O224; O211.6
On-line Access: 2024-08-27
Received: 2023-10-17
Revision Accepted: 2024-05-08
Crosschecked: 0000-00-00
Cited: 1
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WANG Xin, XU Liang-jun. Finite element model analysis of thermal failure in connector[J]. Journal of Zhejiang University Science A, 2007, 8(3): 397-402.
@article{title="Finite element model analysis of thermal failure in connector",
author="WANG Xin, XU Liang-jun",
journal="Journal of Zhejiang University Science A",
volume="8",
number="3",
pages="397-402",
year="2007",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.2007.A0397"
}
%0 Journal Article
%T Finite element model analysis of thermal failure in connector
%A WANG Xin
%A XU Liang-jun
%J Journal of Zhejiang University SCIENCE A
%V 8
%N 3
%P 397-402
%@ 1673-565X
%D 2007
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.2007.A0397
TY - JOUR
T1 - Finite element model analysis of thermal failure in connector
A1 - WANG Xin
A1 - XU Liang-jun
J0 - Journal of Zhejiang University Science A
VL - 8
IS - 3
SP - 397
EP - 402
%@ 1673-565X
Y1 - 2007
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.2007.A0397
Abstract: Thermal analysis and thermal diagnose are important for small power connector especially in electronic devices since their structure is usually compact. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and that increased contact resistance produced more Joule heating; this mutual action causes the connector to lose efficiency. The thermal distribution in the connector was analyzed using finite element method (FEM). The failure mechanism is discussed. It provides basis for improving the structure. The conclusion was verified by experimental results.
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