CLC number: TB114.3; O224; O211.6
On-line Access: 2024-08-27
Received: 2023-10-17
Revision Accepted: 2024-05-08
Crosschecked: 0000-00-00
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YAO Fang, ZHENG Jian-rong, HUANG Zhang-wu. Influence of the ambient air temperature on the electrical contact reliability of electromagnetic relay[J]. Journal of Zhejiang University Science A, 2007, 8(3): 485-489.
@article{title="Influence of the ambient air temperature on the electrical contact reliability of electromagnetic relay",
author="YAO Fang, ZHENG Jian-rong, HUANG Zhang-wu",
journal="Journal of Zhejiang University Science A",
volume="8",
number="3",
pages="485-489",
year="2007",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.2007.A0485"
}
%0 Journal Article
%T Influence of the ambient air temperature on the electrical contact reliability of electromagnetic relay
%A YAO Fang
%A ZHENG Jian-rong
%A HUANG Zhang-wu
%J Journal of Zhejiang University SCIENCE A
%V 8
%N 3
%P 485-489
%@ 1673-565X
%D 2007
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.2007.A0485
TY - JOUR
T1 - Influence of the ambient air temperature on the electrical contact reliability of electromagnetic relay
A1 - YAO Fang
A1 - ZHENG Jian-rong
A1 - HUANG Zhang-wu
J0 - Journal of Zhejiang University Science A
VL - 8
IS - 3
SP - 485
EP - 489
%@ 1673-565X
Y1 - 2007
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.2007.A0485
Abstract: The dynamic contact resistances of HH52P electromagnetic relays are measured under different ambient air temperature. Their diagnostic parameters are extracted and determined. It is found that the ambient air temperature obviously influences some parameters. In order to research its influence on the electrical contact reliability of electromagnetic relay, the statistic analysis is applied to study the static contact resistance, the max of the dynamic contact resistance and the bounce time. It is found that the ambient air temperature regularly influences the three parameters. Thoroughly, the phenomenon is studied and analyzed in the point of material science so as to probe into the essential matter of it.
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