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1Low temperature Si/Si wafer direct bonding using a plasma activated method
Author(s):Dong-ling Li, Zheng-guo Shang, She...  Clicked:7682  Download:5734  Cited:5  <Full Text>
Journal of Zhejiang University Science C  2013 Vol.14 No.4 P.244-251  DOI:10.1631/jzus.C12MNT02
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