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Frontiers of Information Technology & Electronic Engineering

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Antenna-in-package system integrated with meander line antenna based on LTCC technology

Author(s): Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang
Affiliation(s): School of Microelectronics, Xidian University, Xi’an 710071, China
Corresponding email(s): gdong@mail.xidian.edu.cn
Key Words: Antenna-in-package (AiP), Meander line antenna, Multi-chip module (MCM), Low temperature co-fired ceramic (LTCC)

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Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang. Antenna-in-package system integrated with meander line antenna based on LTCC technology[J]. Frontiers of Information Technology & Electronic Engineering,in press.https://doi.org/10.1631/FITEE.1500167

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author="Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang",
journal="Frontiers of Information Technology & Electronic Engineering",
year="in press",
publisher="Zhejiang University Press & Springer",
doi="https://doi.org/10.1631/FITEE.1500167"
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%T Antenna-in-package system integrated with meander line antenna based on LTCC technology
%A Gang Dong
%A Wei Xiong
%A Zhao-yao Wu
%A Yin-tang Yang
%J Frontiers of Information Technology & Electronic Engineering
%P 67-73
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doi="https://doi.org/10.1631/FITEE.1500167"

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T1 - Antenna-in-package system integrated with meander line antenna based on LTCC technology
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A1 - Zhao-yao Wu
A1 - Yin-tang Yang
J0 - Frontiers of Information Technology & Electronic Engineering
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Y1 - in press
PB - Zhejiang University Press & Springer
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doi="https://doi.org/10.1631/FITEE.1500167"

Abstract
Chinese Summary
Academic Network
Reviewer Comment

Abstract: We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.

Abstract: The manuscript developed AiP using LTCC technology. There are many interesting observations.

基于LTCC技术集成曲折线天线的封装天线系统

目的：基于LTCC工艺，设计工作于2.4 GHz频段范围且满足性能指标要求的集成封装天线，同时设计封装腔体结构实现电路芯片的集成。
创新点：设计了一种曲折线天线结构用以实现系统的小型化。在封装层腔体内引入一种叠层多芯片组件结构，提高了整体集成度。通过添加通孔及馈线结构减少天线与封装层内部芯片间的电磁耦合。
方法：首先，基于LTCC的材料特性及设计的性能需要，设计一种曲折线形天线，并对其原理进行分析，对其回波损耗特性进行仿真（图3）。然后，针对封装天线集成电路芯片的需要，提出一种LTCC材料的多芯片组件结构（图8），同时在封装层内加入一定数量的金属通孔（图9），以减少天线与芯片间的电磁耦合。最后，将上述设计的天线与封装层结构整合在一起，并进行实际制作（图12），通过测试得到制作的封装天线系统的方向特性图（图13）和回波损耗特性曲线（图14）。
结论：针对2.4 GHz频段的应用需要，提出了一种小型化高集成度的封装天线结构。该结构满足实际应用所需的性能指标，且能方便地通过LTCC工艺实现。

关键词组：封装天线；曲折线天线；多芯片组件；低温共烧陶瓷

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Reference

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基于LTCC技术集成曲折线天线的封装天线系统

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