CLC number:
On-line Access: 2024-08-27
Received: 2023-10-17
Revision Accepted: 2024-05-08
Crosschecked: 2023-08-22
Cited: 0
Clicked: 1978
Citations: Bibtex RefMan EndNote GB/T7714
Aidi REN, Chengwei YU, Lixia YANG, Wei CUI, Zhixiang HUANG, Ying LIU. A high-isolation coupled-fed building block for metal-rimmed 5G smartphones[J]. Frontiers of Information Technology & Electronic Engineering,in press.https://doi.org/10.1631/FITEE.2300203 @article{title="A high-isolation coupled-fed building block for metal-rimmed 5G smartphones", %0 Journal Article TY - JOUR
一种用于5G金属边框智能手机的高隔离度耦合馈电模块1安徽大学信息材料与智能感知安徽省实验室,中国合肥市,230601 2电磁环境效应航空科技重点实验室,中国沈阳市,110000 3西安电子科技大学天线与微波技术重点实验室,中国西安市,710071 摘要:提出一款应用于第五代金属边框智能手机的高隔离度两天线模块。基于一个蚀刻在地板上的T形缝隙,通过合理地设计一个耦合馈电环天线和一个耦合馈电缝隙天线,实现了一款紧凑的两天线模块。尽管耦合馈电环天线和耦合馈电缝隙天线共口径,两者之间的隔离度高于30 dB。随后,通过集成4个两天线模块,实现了一款8×8多入多出系统。该系统实测互耦和包络相关系数分别小于<−18.5 dB和<0.02。 Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article
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