CLC number: TN821
On-line Access: 2024-08-27
Received: 2023-10-17
Revision Accepted: 2024-05-08
Crosschecked: 2023-10-11
Cited: 0
Clicked: 969
Citations: Bibtex RefMan EndNote GB/T7714
Jiaguo LU, Haoran ZHU. Engineering applications and technical challenges of active array microsystems[J]. Frontiers of Information Technology & Electronic Engineering, 2024, 25(3): 342-368.
@article{title="Engineering applications and technical challenges of active array microsystems",
author="Jiaguo LU, Haoran ZHU",
journal="Frontiers of Information Technology & Electronic Engineering",
volume="25",
number="3",
pages="342-368",
year="2024",
publisher="Zhejiang University Press & Springer",
doi="10.1631/FITEE.2300401"
}
%0 Journal Article
%T Engineering applications and technical challenges of active array microsystems
%A Jiaguo LU
%A Haoran ZHU
%J Frontiers of Information Technology & Electronic Engineering
%V 25
%N 3
%P 342-368
%@ 2095-9184
%D 2024
%I Zhejiang University Press & Springer
%DOI 10.1631/FITEE.2300401
TY - JOUR
T1 - Engineering applications and technical challenges of active array microsystems
A1 - Jiaguo LU
A1 - Haoran ZHU
J0 - Frontiers of Information Technology & Electronic Engineering
VL - 25
IS - 3
SP - 342
EP - 368
%@ 2095-9184
Y1 - 2024
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/FITEE.2300401
Abstract: In the post-Moore era, the development of active phased array antennas will inevitably trend towards active array microsystems. In this paper, the characteristics and composition of the active array antenna are briefly described. Owing to the high efficiency, low profile, and light weight of the active array microsystems, the application prospects and advantages in the engineering of multi-functional airborne radar, spaceborne radar, and communication systems are analyzed. Moreover, according to the characteristics of the post-Moore era of integrated circuits, scientific and technological problems in the active array microsystems are presented, including multi-scale, multi-signal, and multi-physics field coupling. The challenges are also discussed, such as new architectures and algorithms, miniaturization of passive components, novel materials and processes, ultra-wideband technology, and new interdisciplinary technological applications. This paper is expected to inspire in-depth research on active array microsystems.
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