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index	Title
1	Electrical characterization of integrated passive devices using thin film technology for 3D integration Author(s):Xin Sun, Yun-hui Zhu, Zhen-hua Liu...  Clicked:8613  Download:4105  Cited:1  <Full Text> Journal of Zhejiang University Science C  2013 Vol.14 No.4 P.235-243  DOI:10.1631/jzus.C12MNT01
2	Low temperature Si/Si wafer direct bonding using a plasma activated method Author(s):Dong-ling Li, Zheng-guo Shang, She...  Clicked:8467  Download:6136  Cited:5  <Full Text> Journal of Zhejiang University Science C  2013 Vol.14 No.4 P.244-251  DOI:10.1631/jzus.C12MNT02

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