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| 1 | Low temperature Si/Si wafer direct bonding using a plasma activated method Author(s):Dong-ling Li, Zheng-guo Shang, She... Clicked:10468 Download:11597 Cited:5 <Full Text> Journal of Zhejiang University Science C 2013 Vol.14 No.4 P.244-251 DOI:10.1631/jzus.C12MNT02 |