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CLC number: TN828.6
On-line Access: 2024-08-27
Received: 2023-10-17
Revision Accepted: 2024-05-08
Crosschecked: 2023-07-03
Cited: 0
Clicked: 1990
Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
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Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI. Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)[J]. Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926.
@article{title="Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)",
author="Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI",
journal="Frontiers of Information Technology & Electronic Engineering",
volume="24",
number="6",
pages="916-926",
year="2023",
publisher="Zhejiang University Press & Springer",
doi="10.1631/FITEE.2200573"
}
%0 Journal Article
%T Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
%A Zhen FANG
%A Jihua ZHANG
%A Libin GAO
%A Hongwei CHEN
%A Wenlei LI
%A Tianpeng LIANG
%A Xudong CAI
%A Xingzhou CAI
%A Weicong JIA
%A Huan GUO
%A Yong LI
%J Frontiers of Information Technology & Electronic Engineering
%V 24
%N 6
%P 916-926
%@ 2095-9184
%D 2023
%I Zhejiang University Press & Springer
%DOI 10.1631/FITEE.2200573
TY - JOUR
T1 - Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
A1 - Zhen FANG
A1 - Jihua ZHANG
A1 - Libin GAO
A1 - Hongwei CHEN
A1 - Wenlei LI
A1 - Tianpeng LIANG
A1 - Xudong CAI
A1 - Xingzhou CAI
A1 - Weicong JIA
A1 - Huan GUO
A1 - Yong LI
J0 - Frontiers of Information Technology & Electronic Engineering
VL - 24
IS - 6
SP - 916
EP - 926
%@ 2095-9184
Y1 - 2023
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/FITEE.2200573
Abstract: This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of λg/4 slots (defect microstrip structure, DMS) and two λg/2 U-shaped slots (defect ground structure, DGS). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33-GHz broadband filtering antenna is optimized, debugged, and measured. The antenna could achieve |S11|<-10 dB in 29.4‒36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at higher than 16.5 dB. The measurement results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.
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