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CLC number: TN405
On-line Access: 2024-08-27
Received: 2023-10-17
Revision Accepted: 2024-05-08
Crosschecked: 2013-03-15
Cited: 1
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Electrical characterization of integrated passive devices using thin film technology for 3D integration
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Xin Sun, Yun-hui Zhu, Zhen-hua Liu, Qing-hu Cui, Sheng-lin Ma, Jing Chen, Min Miao, Yu-feng Jin. Electrical characterization of integrated passive devices using thin film technology for 3D integration[J]. Journal of Zhejiang University Science C, 2013, 14(4): 235-243.
@article{title="Electrical characterization of integrated passive devices using thin film technology for 3D integration",
author="Xin Sun, Yun-hui Zhu, Zhen-hua Liu, Qing-hu Cui, Sheng-lin Ma, Jing Chen, Min Miao, Yu-feng Jin",
journal="Journal of Zhejiang University Science C",
volume="14",
number="4",
pages="235-243",
year="2013",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.C12MNT01"
}
%0 Journal Article
%T Electrical characterization of integrated passive devices using thin film technology for 3D integration
%A Xin Sun
%A Yun-hui Zhu
%A Zhen-hua Liu
%A Qing-hu Cui
%A Sheng-lin Ma
%A Jing Chen
%A Min Miao
%A Yu-feng Jin
%J Journal of Zhejiang University SCIENCE C
%V 14
%N 4
%P 235-243
%@ 1869-1951
%D 2013
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.C12MNT01
TY - JOUR
T1 - Electrical characterization of integrated passive devices using thin film technology for 3D integration
A1 - Xin Sun
A1 - Yun-hui Zhu
A1 - Zhen-hua Liu
A1 - Qing-hu Cui
A1 - Sheng-lin Ma
A1 - Jing Chen
A1 - Min Miao
A1 - Yu-feng Jin
J0 - Journal of Zhejiang University Science C
VL - 14
IS - 4
SP - 235
EP - 243
%@ 1869-1951
Y1 - 2013
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.C12MNT01
Abstract: With the development of 3D Integration technology, microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices (IPDs), including inductors, capacitors, and resistors, could dramatically save the footprint of the system, optimize the form factor, and improve the performance of radio frequency (RF) systems. In this paper, IPDs using thin film built-up technology are introduced, and the design and characterization of coplanar waveguides (CPWs), inductors, and capacitors are presented.
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