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Journal of Zhejiang University SCIENCE C 1998 Vol.-1 No.-1 P.

http://doi.org/10.1631/FITEE.2200573


Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)


Author(s):  Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI

Affiliation(s):  School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China; more

Corresponding email(s):   zhenfang@std.uestc.edu.cn, jhzhang@uestc.edu.cn

Key Words:  filtering packaging antenna (FPA), through-glass vias (TGVs), 3D packaging devices, laser bonding


Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI. Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)[J]. Frontiers of Information Technology & Electronic Engineering, 1998, -1(-1): .

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journal="Frontiers of Information Technology & Electronic Engineering",
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pages="",
year="1998",
publisher="Zhejiang University Press & Springer",
doi="10.1631/FITEE.2200573"
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%A Jihua ZHANG
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%A Hongwei CHEN
%A Wenlei LI
%A Tianpeng LIANG
%A Xudong CAI
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%A Huan GUO
%A Yong LI
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A1 - Hongwei CHEN
A1 - Wenlei LI
A1 - Tianpeng LIANG
A1 - Xudong CAI
A1 - Xingzhou CAI
A1 - Weicong JIA
A1 - Huan GUO
A1 - Yong LI
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IS - -1
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PB - Zhejiang University Press & Springer
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DOI - 10.1631/FITEE.2200573


Abstract: 
This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass vias (TGVs) technologies. Compared to traditional packaging materials (Printed Circuit Board, LTCC, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave 3D packaging devices) and have superior microwave performance. Glass substrates can realize three-dimensional high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrates enables high-density interconnections and is compatible with MEMS technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The bandpass filter (BPF) unit has three pairs of λg/4 slots (defect microstrip structure (DMS)) and two λg/2 U-shaped slots (defect ground structure (DGS)). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of the four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33 GHz broadband filtering antenna was optimized, debugged and measured. The antenna could achieve |S11| < -10 dB in 29.4 ~ 36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at more than 16.5 dB. The measured results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.

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