Full Text:   <1298>

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CLC number: TN828.6

On-line Access: 2023-07-03

Received: 2022-11-17

Revision Accepted: 2023-01-06

Crosschecked: 2023-07-03

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Citations:  Bibtex RefMan EndNote GB/T7714




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Frontiers of Information Technology & Electronic Engineering  2023 Vol.24 No.6 P.916-926


Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)

Author(s):  Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI

Affiliation(s):  School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China,Chengdu 610054,China; more

Corresponding email(s):   zhenfang@std.uestc.edu.cn, jhzhang@uestc.edu.cn

Key Words:  Filtering packaging antenna (FPA), Through-glass vias (TGVs), 3D packaging devices, Laser bonding

Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI. Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)[J]. Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926.

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author="Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI",
journal="Frontiers of Information Technology & Electronic Engineering",
publisher="Zhejiang University Press & Springer",

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%T Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
%A Zhen FANG
%A Jihua ZHANG
%A Libin GAO
%A Hongwei CHEN
%A Wenlei LI
%A Tianpeng LIANG
%A Xudong CAI
%A Xingzhou CAI
%A Weicong JIA
%A Huan GUO
%A Yong LI
%J Frontiers of Information Technology & Electronic Engineering
%V 24
%N 6
%P 916-926
%@ 2095-9184
%D 2023
%I Zhejiang University Press & Springer
%DOI 10.1631/FITEE.2200573

T1 - Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
A1 - Zhen FANG
A1 - Jihua ZHANG
A1 - Libin GAO
A1 - Hongwei CHEN
A1 - Wenlei LI
A1 - Tianpeng LIANG
A1 - Xudong CAI
A1 - Xingzhou CAI
A1 - Weicong JIA
A1 - Huan GUO
A1 - Yong LI
J0 - Frontiers of Information Technology & Electronic Engineering
VL - 24
IS - 6
SP - 916
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%@ 2095-9184
Y1 - 2023
PB - Zhejiang University Press & Springer
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DOI - 10.1631/FITEE.2200573

This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of λg/4 slots (defect microstrip structure, DMS) and two λg/2 U-shaped slots (defect ground structure, DGS). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33-GHz broadband filtering antenna is optimized, debugged, and measured. The antenna could achieve |S11|<-10 dB in 29.4‒36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at higher than 16.5 dB. The measurement results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.


摘要:以玻璃封装材料和玻璃通孔技术为基础,提出一种新的Ka波段(33 GHz)滤波封装天线(FPA),该天线具有宽频带和高滤波响应特点。与传统封装材料(印刷电路板、低温共烧陶瓷、硅等)相比,玻璃通孔更适合小型化技术(毫米波三维封装器件),具有优越的微波性能。玻璃基板通过键合技术可实现三维高密度互联,其热膨胀系数与硅相当。此外,玻璃基板的堆叠实现了高密度互连,并与微电子技术兼容。该天线辐射贴片由贴片天线和反射系数几乎互补的带通滤波器(BPF)组成。BPF单元有3对λg/4槽(缺陷微带结构)和两对λg/2U形缝隙(缺陷地结构)。该天线实现了大带宽和高辐射效率,这可能与玻璃基板的叠加和玻璃通孔馈电有关。此外,引入4个辐射零值可有效提高阻带内的抑制水平。为验证所提设计性能,对33 GHz宽带滤波天线进行优化、调试和测量。天线的工作带宽为29.4–36.4 GHz (|S11|<−10 dB),阻抗匹配带宽高达21.2%,阻带抑制水平大于16.5 dB。该天线实际增益为∼6.5 dBi,辐射效率为∼89%。


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[1]Cao YF, Zhang Y, Zhang XY, 2020. Filtering antennas: from innovative concepts to industrial applications. Front Inform Technol Electron Eng, 21(1):116-127.

[2]Chen L, Yang XF, Yu DQ, 2021. Development of through glass via technology. Electr Packag, 21(4):040101(in Chinese).

[3]El-Halwagy W, Mirzavand R, Melzer J, et al., 2018. Investigation of wideband substrate-integrated vertically-polarized electric dipole antenna and arrays for mm-wave 5G mobile devices. IEEE Access, 6:2145-2157.

[4]Fang Z, Gao LB, Chen HW, et al., 2022. 3D interdigital electrodes dielectric capacitor array for energy storage based on through glass vias. Adv Mater Technol, 7(8):2101530.

[5]He YQ, Rao ML, Liu YJ, et al., 2020. 28/39-GHz dual-band dual-polarized millimeter wave stacked patch antenna array for 5G applications. Int Workshop on Antenna Technology, p.1-4.

[6]Hu HT, Chan KF, Chan CH, 2022. 60 GHz Fabry–Pérot cavity filtering antenna driven by an SIW-fed filtering source. IEEE Trans Antenn Propag, 70(2):823-834.

[7]Hu KZ, Tang MC, Li DJ, et al., 2020. Design of compact, single-layered substrate integrated waveguide filtenna with parasitic patch. IEEE Trans Antenn Propag, 68(2):1134-1139.

[8]Hu PF, Pan YM, Zhang XY, et al., 2016. A compact filtering dielectric resonator antenna with wide bandwidth and high gain. IEEE Trans Antenn Propag, 64(8):3645-3651.

[9]Hu PF, Pan YM, Zhang XY, et al., 2019. A filtering patch antenna with reconfigurable frequency and bandwidth using F-shaped probe. IEEE Trans Antenn Propag, 67(1):121-130.

[10]Hwang IJ, Jo HW, Kim JW, et al., 2017. Vertically stacked folded dipole antenna using multi-layer for mm-wave mobile terminals. IEEE Int Symp on Antennas and Propagation & USNC/URSI National Radio Science Meeting, p.2579-2580.

[11]Jin JY, Liao SW, Xue Q, 2018. Design of filtering-radiating patch antennas with tunable radiation nulls for high selectivity. IEEE Trans Antenn Propag, 66(4):2125-2130.

[12]Li JF, Chen ZN, Wu DL, et al., 2018. Dual-beam filtering patch antennas for wireless communication application. IEEE Trans Antenn Propag, 66(7):3730-3734.

[13]Li JF, Mao CX, Wu DL, et al., 2021. A dual-beam wideband filtering patch antenna with absorptive band-edge radiation nulls. IEEE Trans Antenn Propag, 69(12):8926-8931.

[14]Li WL, Zhang JH, Gao LB, et al., 2023. Wideband analysis and prolongation of surrounding TGVs shielding structure in 3-D ICs. IEEE Microw Wirel Technol Lett, 33(1):39-42.

[15]Li WX, Xu KD, Tang XH, et al., 2017. Substrate integrated waveguide cavity-backed slot array antenna using high-order radiation modes for dual-band applications in K-band. IEEE Trans Antenn Propag, 65(9):4556-4565.

[16]Liu YT, Leung KW, Yang N, 2020. Compact absorptive filtering patch antenna. IEEE Trans Antenn Propag, 68(2):633-642.

[17]Shah U, Liljeholm J, Campion J, et al., 2018. Low-loss, high-linearity RF interposers enabled by through glass vias. IEEE Microw Wirel Compon Lett, 28(11):960-962.

[18]Shao ZJ, Zhang YP, 2021. A single-layer miniaturized patch antenna based on coupled microstrips. IEEE Antenn Wirel Propag Lett, 20(5):823-827.

[19]Su YQ, Yu DQ, Ruan WB, et al., 2022. Development of compact millimeter-wave antenna by stacking of five glass wafers with through glass vias. IEEE Electron Device Lett, 43(6):934-937.

[20]Watanabe AO, Lin TH, Ali M, et al., 2020. Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias. IEEE Trans Microw Theory Techn, 68(12):5082-5092.

[21]Wu QS, Zhang X, Zhu L, 2018. Co-design of a wideband circularly polarized filtering patch antenna with three minima in axial ratio response. IEEE Trans Antenn Propag, 66(10):5022-5030.

[22]Xia HY, Zhang T, Li LM, et al., 2020. A 1×2 taper slot antenna array with flip-chip interconnect via glass-IPD technology for 60 GHz radar sensors. IEEE Access, 8:61790-61796.

[23]Yao SS, Cheng YJ, Zhou MM, et al., 2020. D-band wideband air-filled plate array antenna with multistage impedance matching based on MEMS micromachining technology. IEEE Trans Antenn Propag, 68(6):4502-4511.

[24]Zhang BH, Xue Q, 2018. Filtering antenna with high selectivity using multiple coupling paths from source/load to resonators. IEEE Trans Antenn Propag, 66(8):4320-4325.

[25]Zhang XY, Duan W, Pan YM, 2015. High-gain filtering patch antenna without extra circuit. IEEE Trans Antenn Propag, 63(12):5883-5888.

[26]Zhang XY, Zhang Y, Pan YM, et al., 2017. Low-profile dual-band filtering patch antenna and its application to LTE MIMO system. IEEE Trans Antenn Propag, 65(1):103-113.

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