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Abstract: This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass vias (TGVs) technologies. Compared to traditional packaging materials (Printed Circuit Board, LTCC, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave 3D packaging devices) and have superior microwave performance. Glass substrates can realize three-dimensional high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrates enables high-density interconnections and is compatible with MEMS technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The bandpass filter (BPF) unit has three pairs of λ_g/4 slots (defect microstrip structure (DMS)) and two λ_g/2 U-shaped slots (defect ground structure (DGS)). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of the four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33 GHz broadband filtering antenna was optimized, debugged and measured. The antenna could achieve |S11| < -10 dB in 29.4 ~ 36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at more than 16.5 dB. The measured results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.