Full Text:   <1298>

Summary:  <153>

CLC number: TN828.6

On-line Access: 2023-07-03

Received: 2022-11-17

Revision Accepted: 2023-01-06

Crosschecked: 2023-07-03

Cited: 0

Clicked: 1094

Citations:  Bibtex RefMan EndNote GB/T7714

 ORCID:

Zhen FANG

https://orcid.org/0000-0001-8482-8013

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Frontiers of Information Technology & Electronic Engineering  2023 Vol.24 No.6 P.916-926

http://doi.org/10.1631/FITEE.2200573


Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)


Author(s):  Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI

Affiliation(s):  School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China,Chengdu 610054,China; more

Corresponding email(s):   zhenfang@std.uestc.edu.cn, jhzhang@uestc.edu.cn

Key Words:  Filtering packaging antenna (FPA), Through-glass vias (TGVs), 3D packaging devices, Laser bonding


Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI. Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)[J]. Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926.

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author="Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI",
journal="Frontiers of Information Technology & Electronic Engineering",
volume="24",
number="6",
pages="916-926",
year="2023",
publisher="Zhejiang University Press & Springer",
doi="10.1631/FITEE.2200573"
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%T Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
%A Zhen FANG
%A Jihua ZHANG
%A Libin GAO
%A Hongwei CHEN
%A Wenlei LI
%A Tianpeng LIANG
%A Xudong CAI
%A Xingzhou CAI
%A Weicong JIA
%A Huan GUO
%A Yong LI
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A1 - Hongwei CHEN
A1 - Wenlei LI
A1 - Tianpeng LIANG
A1 - Xudong CAI
A1 - Xingzhou CAI
A1 - Weicong JIA
A1 - Huan GUO
A1 - Yong LI
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DOI - 10.1631/FITEE.2200573


Abstract: 
This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of λg/4 slots (defect microstrip structure, DMS) and two λg/2 U-shaped slots (defect ground structure, DGS). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33-GHz broadband filtering antenna is optimized, debugged, and measured. The antenna could achieve |S11|<-10 dB in 29.4‒36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at higher than 16.5 dB. The measurement results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.

基于玻璃通孔的Ka波段宽带滤波封装天线

方针1,2,张继华1,2,3,高莉彬1,2,陈宏伟1,2,李文磊1,2
梁天鹏1,2,蔡旭东1,2,蔡星周3,贾惟聪3,郭欢3,李勇3
1电子科技大学集成电路科学与工程学院,中国成都市,610054
2电子科技大学电子薄膜与集成器件国家重点实验室,中国成都市,610054
3成都迈科科技有限公司,中国成都市,611731
摘要:以玻璃封装材料和玻璃通孔技术为基础,提出一种新的Ka波段(33 GHz)滤波封装天线(FPA),该天线具有宽频带和高滤波响应特点。与传统封装材料(印刷电路板、低温共烧陶瓷、硅等)相比,玻璃通孔更适合小型化技术(毫米波三维封装器件),具有优越的微波性能。玻璃基板通过键合技术可实现三维高密度互联,其热膨胀系数与硅相当。此外,玻璃基板的堆叠实现了高密度互连,并与微电子技术兼容。该天线辐射贴片由贴片天线和反射系数几乎互补的带通滤波器(BPF)组成。BPF单元有3对λg/4槽(缺陷微带结构)和两对λg/2U形缝隙(缺陷地结构)。该天线实现了大带宽和高辐射效率,这可能与玻璃基板的叠加和玻璃通孔馈电有关。此外,引入4个辐射零值可有效提高阻带内的抑制水平。为验证所提设计性能,对33 GHz宽带滤波天线进行优化、调试和测量。天线的工作带宽为29.4–36.4 GHz (|S11|<−10 dB),阻抗匹配带宽高达21.2%,阻带抑制水平大于16.5 dB。该天线实际增益为∼6.5 dBi,辐射效率为∼89%。

关键词:滤波封装天线;玻璃通孔;三维封装器件;激光键合

Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article

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