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Abstract: High strength and high conductivity Cu-based materials are key requirements in high-speed railway and high-field magnet systems. Cu-Fe alloys represent one of the most promising candidates due to the cheapness of Fe compared to Cu-Ag and Cu-Nb alloys. The high strength of Cu-Fe alloys primarily relies on the high density of the Cu/Fe phase interface, which is controlled by the co-deformation of the Cu matrix and Fe phase. In this study, our main attention was focused on the deformation behavior of the Fe phase using different scales. Cu-2.5% Fe-0.2% Cr (in weight) and Cu-6% Fe alloys were cast, annealed, and cold drawn into wires to investigate their microstructure and properties evolution. Cu-6% Fe contains Cu matrix and Fe, which become the primary particles in the micrometer scale after solution treatment. Cu-2.5% Fe-0.2% Cr contains Cu matrix and Fe precipitate particles in a nanometer scale after solution and aging treatment. The Fe primary particles were elongated and evolved into ribbons in a nanometer scale while the Fe precipitate particles were hardly deformed even at a drawing strain of 6. The reason for the unchanging characteristics of Fe precipitate particles is due to the size effect and incoherent phase interface of Cu matrix and Fe precipitate particles. The strength of both Cu-6% Fe and Cu-2.5% Fe-0.2% Cr alloys increases with the increase in the drawing strain. The electrical resistivity of Cu-6% Fe gradually increases and that of Cu-2.5% Fe-0.2% Cr keeps almost constant with the increase in the drawing strain.

This is a very interesting contribution to the field of highly strained electrical conductors based on copper composites. Specifically the approach to study the less expensive combination of Cu and Fe is of some relevance in this field. The work has been well described and the results are of interest to the community in this field. Thus I wish to applaud the authors for a nice piece of work.

冷拉拔Cu-2.5% Fe-0.2% Cr和Cu-6% Fe合金的显微组织与性能

[1]Badinier, G., Sinclair, C.W., Allain, S., et al., 2014. The Bauschinger effect in drawn and annealed nanocomposite Cu-Nb wires. Materials Science and Engineering: A, 597:10-19.

[2]Bevk, J., Harbison, J.P., Bell, J.L., 1978. Anomalous increase in strength of in situ formed Cu-Nb multifilamentary composites. Journal of Applied Physics, 49(12):6031-6038.

[3]Biselli, C., Morris, D.G., 1994. Microstructure and strength of Cu-Fe in-situ composites obtained from prealloyed Cu-Fe powders. Acta Metallurgica et Materialia, 42(1):163-176.

[4]Biselli, C., Morris, D.G., 1996. Microstructure and strength of Cu-Fe in situ composites after very high drawing strains. Acta Materialia, 44(2):493-504.

[5]Deng, L.P., Han, K., Hartwig, K.T., et al., 2014. Hardness, electrical resistivity, and modeling of in situ Cu-Nb microcomposites. Journal of Alloys and Compounds, 602:331-338.

[6]Dunstan, D.J., Bushby, A.J., 2013. The scaling exponent in the size effect of small scale plastic deformation. International Journal of Plasticity, 40:152-162.

[7]Frommeyer, G., Wassermann, G., 1975. Microstructure and anomalous mechanical properties of in situ-produced silver-copper composite wires. Acta Metallurgica, 23(11):1353-1360.

[8]Han, K., Vasquez, A.A., Xin, Y., et al., 2003. Microstructure and tensile properties of nanostructured Cu-25wt%Ag. Acta Materialia, 51(3):767-780.

[9]Hangen, U., Raabe, D., 1995. Modeling of the yield strength of a heavily wire drawn Cu-20-percent-Nb composite by use of a modified linear rule of mixtures. Acta Metallurgica et Materialia, 43(11):4075-4082.

[10]Heringhaus, F., 1998. Quantitative Analysis of the Influence of the Microstructure on Strength, Resistivity, and Magnetoresistance of Eutectic Silver-copper. PhD Thesis, Institut fur Metallkunde und Metallphysik, RWTH Aachen, Germany; National High Magnetic Field Laboratory Tallahassee, USA.

[11]Hong, S.I., Hill, M.A., 1999. Mechanical stability and electrical conductivity of Cu–Ag filamentary microcomposites. Materials Science and Engineering: A, 264(1-2):151-158.

[12]Hong, S.I., Song, J.S., 2001. Strength and conductivity of Cu-9Fe-1.2X (X=Ag or Cr) filamentary microcomposite wires. Metallurgical and Materials Transaction A, 32(4):985-991.

[13]Jia, N., Roters, F., Eisenlohr, P., et al., 2013. Simulation of shear banding in heterophase co-deformation: example of plane strain compressed Cu-Ag and Cu-Nb metal matrix composites. Acta Materialia, 61(12):4591-4606.

[14]Karasek, K.R., Bevk, J., 1981. Normal-state resistivity of in situ-formed ultrafine filamentary Cu-Nb composites. Journal of Applied Physics, 52(3):1370-1375.

[15]Legros, M., Elliott, B.R., Rittner, M.N., et al., 2000. Microsample tensile testing of nanocrystalline metals. Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties, 80(4):1017-1026.

[16]Liu, J.B., Zhang, L., Meng, L., 2011a. Codeformation in Cu-6wt.% Ag nanocomposites. Scripta Materialia, 64(7):665-668.

[17]Liu, J.B., Zhang, L., Yao, D.W., et al., 2011b. Microstructure evolution of Cu/Ag interface in the Cu–6 wt.% Ag filamentary nanocomposite. Acta Materialia, 59(3):1191-1197.

[18]Liu, K.M., Lu, D.P., Zhou, H.T., et al., 2013. Influence of a high magnetic field on the microstructure and properties of a Cu–Fe–Ag in situ composite. Materials Science and Engineering: A, 584:114-120.

[19]Lu, X.P., Yao, D.W., Chen, Y., et al., 2014. Microstructure and hardness of Cu-12% Fe composite at different drawing strains. Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering), 15(2):149-156.

[20]Mattissen, D., Rabbe, D., Heringhaus, F., 1999. Experimental investigation and modeling of the influence of microstructure on the resistive conductivity of a Cu–Ag–Nb in situ composite. Acta Materialia, 47(5):1627-1634.

[21]Monzen, R., Kita, K., 2002. Ostwald ripening of spherical Fe particles in Cu-Fe alloys. Philosophical Magazine Letters, 82(7):373-382.

[22]Pantsyrny, V.I., Khlebova, N.E., Sudyev, S.V., et al., 2014. Thermal stability of the high strength high conductivity Cu-Nb, Cu-V, and Cu-Fe nanostructured microcomposite wires. IEEE Transaction of Applied Superconductor, 24(3):0502804.

[23]Raabe, D., Ball, J., Gottstein, G., 1992. Rolling textures of a Cu-20-percent-Nb composite. Scripta Metallurgica et Materialia, 27(2):211-216.

[24]Raabe, D., Heringhaus, F., Hangen, U., et al., 1995a. Investigation of a Cu-20 mass-percent Nb in-situ composite. 1. Fabrication, microstructure and mechanical properties. Zeitschrift Fur Metallkunde, 86:405-415.

[25]Raabe, D., Heringhaus, F., Hangen, U., et al., 1995b. Investigation of a Cu-20 mass-percent Nb in-situ composite. 2. Electromagnetic properties and application. Zeitschrift Fur Metallkunde, 86:416-422.

[26]Raabe, D., Miyake, K., Takahara, H., 2000. Processing, microstructure, and properties of ternary high-strength Cu–Cr–Ag in situ composites. Materials Science and Engineering: A, 291(1-2):186-197.

[27]Raju, K.S., Sarma, V.S., Kauffmann, A., et al., 2013. High strength and ductile ultrafine-grained Cu-Ag alloy through bimodal grain size, dislocation density and solute distribution. Acta Materialia, 61(1):228-238.

[28]Sinclair, C.W., Embury, J.D., Weatherly, G.C., 1999. Basic aspects of the co-deformation of bcc/fcc materials. Materials Science and Engineering: A, 272(1):90-98.

[29]Sitarama Raju, K., Subramanya Sarma, V., Kauffmann, A., et al., 2013. High strength and ductile ultrafine-grained Cu–Ag alloy through bimodal grain size, dislocation density and solute distribution. Acta Materialia, 61(1):228-238.

[30]Song, J.S., Hong, S.I., Kim, H.S., 2001. Heavily drawn Cu-Fe-Ag and Cu-Fe-Cr microcomposites. Journal of Materials Processing Technology, 113(1-3):610-616.

[31]Spitzig, W.A., Pelton, A.R., Laabs, F.C., 1987. Characterization of the strength and microstructure of heavily cold worked Cu-Nb composites. Acta Metallurgica, 35(10):2427-2442.

[32]Tian, Y.Z., Zhang, Z.F., 2009. Microstructures and tensile deformation behavior of Cu–16wt.%Ag binary alloy. Materials Science and Engineering: A, 508(1-2):209-213.

[33]Tian, Y.Z., Wu, S.D., Zhang, Z.F., et al., 2011. Comparison of microstructures and mechanical properties of a Cu–Ag alloy processed using different severe plastic deformation modes. Materials Science and Engineering: A, 528(13-14):4331-4336.

[34]Wang, Y.F., Gao, H.Y., Wang, J., et al., 2014. First-principles calculations of Ag addition on the diffusion mechanisms of Cu-Fe alloys. Solid State Communications, 183:60-63.

[35]Watanabe, D., Watanabe, C., Monzen, R., 2008. Effect of coherency on coarsening of second-phase precipitates in Cu-base alloys. Journal of Materials Science, 43(11):3946-3953.

[36]Wu, Z.W., Chen, Y., Meng, L., 2009. Microstructure and properties of Cu-Fe microcomposites with prior homogenizing treatments. Journal of Alloys and Compounds, 481(1-2):236-240.

[37]Xie, Z., Gao, H., Wang, J., et al., 2011. Effect of homogenization treatment on microstructure and properties for Cu–Fe–Ag in situ composites. Materials Science and Engineering: A, 529:388-392.