| index | Title |
| 1 | Electrical characterization of integrated passive devices using thin film technology for 3D integration Author(s):Xin Sun, Yun-hui Zhu, Zhen-hua Liu... Clicked:10522 Download:5900 Cited:1 <Full Text> Journal of Zhejiang University Science C 2013 Vol.14 No.4 P.235-243 DOI:10.1631/jzus.C12MNT01 |
| 2 | Low temperature Si/Si wafer direct bonding using a plasma activated method Author(s):Dong-ling Li, Zheng-guo Shang, She... Clicked:10477 Download:11617 Cited:5 <Full Text> Journal of Zhejiang University Science C 2013 Vol.14 No.4 P.244-251 DOI:10.1631/jzus.C12MNT02 |