| index | Title |
| 31 | Deep3DSketch-im: rapid high-fidelity AI 3D model generation by single freehand sketches Author(s):Tianrun CHEN, Runlong CAO, Zejian ... Clicked:3947 Download:13154 Cited:0 <Full Text> <PPT> 1321 Frontiers of Information Technology & Electronic Engineering 2024 Vol.25 No.1 P.149-159 DOI:10.1631/FITEE.2300314 |
| 32 | Oxygen tension modulates cell function in an in vitro
three-dimensional glioblastoma tumor model Author(s):Sen Wang, Siqi Yao, Na Pei, Luge B... Clicked:1686 Download:986 Cited:0 <Full Text> Journal of Zhejiang University Science 2006 Vol.7 No.3 P.307-319 DOI:10.1007/s42242-024-00271-9 |
| 33 | From 2D to 3D: transforming malignant bone tumor research with advanced culture models Author(s):Zhengcheng HE, Haitao HUANG, Jiale... Clicked:3306 Download:5026 Cited:0 <Full Text> <PPT> 419 Journal of Zhejiang University Science B 2025 Vol.26 No.11 P.1059-1075 DOI:10.1631/jzus.B2400288 |
| 34 | Three-dimensional (3D) printing-assisted freeze-casting of processed pyritum-doped β-tricalcium phosp... Author(s):Chenxu WEI, Zongan LI, Xiaoyun LIA... Clicked:3899 Download:5555 Cited:0 <Full Text> <PPT> 786 Journal of Zhejiang University Science B 2025 Vol.26 No.9 P.863-880 DOI:10.1631/jzus.B2400340 |
| 35 | Effective fault detection in M3D ICs: a cluster-based BIST for enhanced inter-layer via fault coverage Author(s):Hadi JAHANIRAD, Ahmad MENBARI, Hem... Clicked:1135 Download:624 Cited:0 <Full Text> Frontiers of Information Technology & Electronic Engineering 2025 Vol.26 No.10 P.2041-2063 DOI:10.1631/FITEE.2401094 |
| 36 | Tissue engineering tubular scaffold fabrication for esophageal regeneration Author(s):Xingyu Zhou Clicked:269 Download:310 Cited: <Full Text> Journal of Zhejiang University Science B 2008 Vol.9 No.1 P.100 - 121 DOI:10.1631/bdm.2500027 |
| 37 | Novel bromoacetophenone-accelerated visible-light 3D and 4D printing methods for rapid fabrication of bioco... Author(s):Nima Tabatabaei Rezaei Clicked:395 Download:186 Cited: <Full Text> Journal of Zhejiang University Science B 2008 Vol.9 No.2 P.379 - 398 DOI:10.1631/bdm.2500337 |
| 38 | A hybrid redundancy and serialization fault-tolerant architecture for through-silicon via interconnects Author(s):Chenglong SUN1,2Clicked:136 Download:53 Cited:0 <Full Text> Journal of Zhejiang University Science 1998 Vol.-1 No.-1 P. DOI:10.1631/ENG.ITEE.2025.0156 |