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index	Title
1	Low temperature Si/Si wafer direct bonding using a plasma activated method Author(s):Dong-ling Li, Zheng-guo Shang, She...  Clicked:8300  Download:6086  Cited:5  <Full Text> Journal of Zhejiang University Science C  2013 Vol.14 No.4 P.244-251  DOI:10.1631/jzus.C12MNT02
2	3D analysis for pit evolution and pit-to-crack transition during corrosion fatigue Author(s):Xiao-guang Huang, Jin-quan Xu  Clicked:6534  Download:4332  Cited:3  <Full Text>  <PPT> 2110 Journal of Zhejiang University Science A  2013 Vol.14 No.4 P.292-299  DOI:10.1631/jzus.A1200273
3	Relation between drying shrinkage behavior and the microstructure of metakaolin-based geopolymer Author(s):Shi-kun Chen, Cheng-lin Wu, Dong-m...  Clicked:3903  Download:3003  Cited:0  <Full Text>  <PPT> 1489 Journal of Zhejiang University Science A  2021 Vol.22 No.10 P.819-834  DOI:10.1631/jzus.A2000513

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