ENGINEERING Information Technology & Electronic Engineering  2026 Vol.27 No.10 P.1-3

http://doi.org/10.1631/ENG.ITEE.2026.0238


Hardware–algorithm co-design for 3D arrays: unlocking spatial degrees of freedom with mutual coupling


Author(s):  Yuqi HU, Ran JI, Chongwen HUANG, Li WEI, Xiaoming CHEN, Wei E. I. SHA, Jiguang HE, Zhaoyang ZHANG, Mérouane DEBBAH

Affiliation(s):  1. College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China more

Corresponding email(s):   chongwenhuang@zju.edu.cn

Key Words: 


Yuqi HU, Ran JI, Chongwen HUANG, Li WEI, Xiaoming CHEN, Wei E. I. SHA, Jiguang HE, Zhaoyang ZHANG, Mérouane DEBBAH. Hardware–algorithm co-design for 3D arrays: unlocking spatial degrees of freedom with mutual coupling[J]. Journal of Zhejiang University Science C, 2026, 27(10): 1-3.

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author="Yuqi HU, Ran JI, Chongwen HUANG, Li WEI, Xiaoming CHEN, Wei E. I. SHA, Jiguang HE, Zhaoyang ZHANG, Mérouane DEBBAH",
journal="Journal of Zhejiang University Science C",
volume="27",
number="10",
pages="1-3",
year="2026",
publisher="Zhejiang University Press & Springer",
doi="10.1631/ENG.ITEE.2026.0238"
}

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%A Chongwen HUANG
%A Li WEI
%A Xiaoming CHEN
%A Wei E. I. SHA
%A Jiguang HE
%A Zhaoyang ZHANG
%A Mérouane DEBBAH
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%I Zhejiang University Press & Springer
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A1 - Yuqi HU
A1 - Ran JI
A1 - Chongwen HUANG
A1 - Li WEI
A1 - Xiaoming CHEN
A1 - Wei E. I. SHA
A1 - Jiguang HE
A1 - Zhaoyang ZHANG
A1 - Mérouane DEBBAH
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PB - Zhejiang University Press & Springer
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DOI - 10.1631/ENG.ITEE.2026.0238


Abstract: 
Three-dimensional (3D) antenna arrays are crucial for enhancing the capacity of 6G systems, with sub-array-based hybrid beamforming widely adopted to control hardware costs. However, current precoding designs typically assume ideal conditions, neglecting the impact of the physical layout on electromagnetic (EM) mutual coupling. This correspondence highlights that compact layouts inherently induce near-field coupling, while the connection architecture dictates inter-layer leakage and interference. Consequently, sub-optimal hardware configurations severely constrain the performance of subsequent base band algorithms. To bridge the gap between theory and deployment, we advocate moving beyond traditional fixed-hardware assumptions toward a co-design of physical architectures and signal processing. Effectively mitigating adverse EM states requires geometry-aware coupling models, the introduction of dynamic sub-array reconfiguration, and the joint optimization of structural parameters and precoding weights. This hardware–algorithm co-design represents a critical pathway to unlocking the true potential of 3D arrays.

面向三维天线阵列的硬件与算法协同设计:基于互耦效应挖掘空间自由度

胡钰琪1,季然2,黄崇文1,魏丽1,陈晓明3,沙威1,何继光4,张朝阳1,Mérouane Debbah5
1浙江大学信息与电子工程学院,中国杭州市,310027
2普林斯顿大学电气与计算机工程系,美国普林斯顿市,08544
3西安交通大学信息与通信工程学院,中国西安市,710049
4大湾区大学信息科学技术学院,中国东莞市,523000
5哈利法大学6G研究中心,阿拉伯联合酋长国阿布扎比,127788信箱
摘要:三维天线阵列是提升6G系统容量的关键技术,其中基于子阵列的混合波束赋形架构因能有效控制硬件成本而被广泛采用。然而,现有的预编码设计多基于理想条件假设,忽略了天线物理布局对电磁互耦效应的实际影响。本文指出,紧凑的天线布局会不可避免地引发强烈耦合,而硬件连接架构直接决定了阵列层间的信号泄漏与干扰。因此,次优的硬件配置会严重制约后续基带算法的性能。为缩小理论研究与实际部署之间的差距,本文提倡突破硬件架构固定的传统假设,转而采用物理架构与信号处理协同设计的框架。为有效抑制不利的电磁效应,需要构建几何感知的耦合模型,引入动态子阵列重构技术,并实现阵列结构参数与预编码权值的联合优化。该硬件与算法的协同设计方案是充分挖掘三维天线阵列潜能的关键路径。

关键词:三维天线阵列;混合波束赋形;硬件架构;互耦效应;硬件算法协同设计

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Reference

[1]Björnson E, Chae CB, Heath RW Jr, et al., 2024. Towards 6G MIMO: massive spatial multiplexing, dense arrays, and interplay between electromagnetics and processing.

[2]El Ayach O, Rajagopal S, Abu-Surra S, et al., 2014. Spatially sparse precoding in millimeter wave MIMO systems. IEEE Trans Wirel Commun, 13(3):1499-1513.

[3]Ji R, Huang CW, Chen XM, et al., 2024. Electromagnetic hybrid beamforming for holographic MIMO communications. IEEE Trans Wirel Commun, 23(11):15973-15986.

[4]Ji R, Huang CW, Chen XM, et al., 2026. Exploring Hannan limitation for 3D antenna array. Sci China Inform Sci, 69(5):152301.

[5]Liu MB, Yuen C, Niyato D, et al., 2026. In-wave computation aided stacked intelligent metasurfaces in next-generation networks: challenges and opportunities. IEEE Wirel Commun, 33(4):56-63.

Full Text:   <10>

CLC number: TN82

On-line Access: 2026-11-11

Received: 2026-07-28

Revision Accepted: 2026-09-14

Crosschecked: 2026-11-11

Cited: 0

Clicked: 12

Citations:  Bibtex RefMan EndNote GB/T7714

 ORCID:

Chongwen HUANG

0000-0001-8398-8437

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