Deep search:Searching for "laplace transform" in 'ABSTRACTGot 7 items.
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1Transient response of a spherical cavity with a partially sealed shell embedded in viscoelastic saturated s...
Author(s):LIU Gan-bin, XIE Kang-he  Clicked:6633  Download:3224  Cited:0  <Full Text>
Journal of Zhejiang University Science A  2005 Vol.6 No.3 P.194-201  DOI:10.1631/jzus.2005.A0194
2Computation of one-dimensional consolidation of double layered ground using differential quadrature method
Author(s):WANG Hong-zhi, CHEN Yun-min, HUANG...  Clicked:5596  Download:2674  Cited:3  <Full Text>
Journal of Zhejiang University Science  2003 Vol.4 No.2 P.195-201  DOI:10.1631/jzus.2003.0195
3Study on one-dimensional consolidation of saturated soil with semi-pirviovs boundaries and under cyclic loa...
Author(s):LIANG Xu, CAI Yuan-qiang, WU Shi-m...  Clicked:5950  Download:2700  Cited:0  <Full Text>
Journal of Zhejiang University Science  2002 Vol.3 No.5 P.513-519  DOI:10.1631/jzus.2002.0513
4Calculating the transient behavior of grounding systems using inverse Laplace transform
Author(s):Nabiollah Ramezani, Seyed Mohammad...  Clicked:6829  Download:3910  Cited:0  <Full Text>
Journal of Zhejiang University Science C  2011 Vol.12 No.3 P.250-262  DOI:10.1631/jzus.C0910777
5A semi-analytical state-space approach for 3D transient analysis of functionally graded material cylindrica...
Author(s):Xu Liang, Hai-lei Kou, Guo-hua Liu...  Clicked:5405  Download:3082  Cited:2  <Full Text>  <PPT> 2139
Journal of Zhejiang University Science A  2015 Vol.16 No.7 P.525-540  DOI:10.1631/jzus.A1500016
6A semi-analytical method and its application for calculating the thermal stress and displacement of sparsel...
Author(s):Yong Zhang, Yan-yong Xiang  Clicked:5599  Download:2689  Cited:0  <Full Text>  <PPT> 2139
Journal of Zhejiang University Science A  2015 Vol.16 No.11 P.922-934  DOI:10.1631/jzus.A1400364
7End-to-end delay analysis for networked systems
Author(s):Jie Shen, Wen-bo He, Xue Liu, Zhi-...  Clicked:6735  Download:2711  Cited:1  <Full Text>  <PPT> 1834
Frontiers of Information Technology & Electronic Engineering  2015 Vol.16 No.9 P.732-743  DOI:10.1631/FITEE.1400414
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