index | Title |
1 | An efficient numerical shape analysis for light weight membrane structures Author(s):Chao Yang, Yan-bin Shen, Yao-zhi Luo Clicked:7756 Download:3798 Cited:5 <Full Text> <PPT> 2211 Journal of Zhejiang University Science A 2014 Vol.15 No.4 P.255-271 DOI:10.1631/jzus.A1300245 |
2 | A vector-form hybrid particle-element method for modeling and nonlinear shell analysis of thin membranes ex... Author(s):Yao-zhi Luo, Chao Yang Clicked:6800 Download:3194 Cited:3 <Full Text> <PPT> 2492 Journal of Zhejiang University Science A 2014 Vol.15 No.5 P.331-350 DOI:10.1631/jzus.A1300248 |
3 | On-chip optical interconnect using visible light Author(s):Wei Cai, Bing-cheng Zhu, Xu-min Ga... Clicked:6846 Download:2191 Cited:1 <Full Text> <PPT> 1933 Frontiers of Information Technology & Electronic Engineering 2017 Vol.18 No.9 P.1288-1294 DOI:10.1631/FITEE.1601720 |
4 | Driftor: mitigating cloud-based side-channel attacks by switching and migrating multi-executor virtual mach... Author(s):Chao Yang, Yun-fei Guo, Hong-chao ... Clicked:6319 Download:2431 Cited:0 <Full Text> <PPT> 1860 Frontiers of Information Technology & Electronic Engineering 2019 Vol.20 No.5 P.731-748 DOI:10.1631/FITEE.1800526 |
5 | Modified stepwise mini-incision microdissection testicular sperm extraction: a useful technique for patient... Author(s):Peng Li, Chen-Cheng Yao, Er-Lei Zh... Clicked:4008 Download:2471 Cited:0 <Full Text> <PPT> 2042 Journal of Zhejiang University Science B 2020 Vol.21 No.1 P.87-92 DOI:10.1631/jzus.B1900232 |
6 | GPU-accelerated vector-form particle-element method for 3D elastoplastic contact of structures Author(s):Wei WANG, Yanfeng ZHENG, Jingzhe T... Clicked:9384 Download:2355 Cited:0 <Full Text> <PPT> 418 Journal of Zhejiang University Science A 2023 Vol.24 No.12 P.1120-1130 DOI:10.1631/jzus.A2200311 |
7 | COPPER: a combinatorial optimization problem solver with processing-in-memory architecture Author(s):Qiankun WANG, Xingchen LI, Bingzhe... Clicked:2355 Download:5891 Cited:0 <Full Text> <PPT> 544 Frontiers of Information Technology & Electronic Engineering 2023 Vol.24 No.5 P.731-741 DOI:10.1631/FITEE.2200463 |