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6 results found in all.
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1Dynamic user-centric multi-dimensional resource allocation for a wide-area coverage signaling cell based on DQN
Author(s):Zhou TONG, Na LI, Huimin ZHANG, Quan ZHAO, Yun ZHAO, Junshuai SUN, Guangyi LIU  Clicked:2181  Download:6888  Cited:0  <Full Text>  <PPT> 367
Frontiers of Information Technology & Electronic Engineering  2023 Vol.24 No.1 P.154-163  DOI:10.1631/FITEE.2200220
2Discussion on a new paradigm of endogenous security towards 6G networks
Author(s):Xinsheng JI, Jiangxing WU, Liang JIN, Kaizhi HUANG, Yajun CHEN, Xiaoli SUN, Wei YOU, Shumin HUO, Jing YANG  Clicked:2597  Download:9503  Cited:0  <Full Text>  <PPT> 415
Frontiers of Information Technology & Electronic Engineering  2022 Vol.23 No.10 P.1421-1450  DOI:10.1631/FITEE.2200060
3Simultaneously transmitting and reflecting (STAR) RISs for 6G: fundamentals, recent advances, and future directions
Author(s):Yuanwei LIU, Jiaqi XU, Zhaolin WANG, Xidong MU, Jianhua ZHANG, Ping ZHANG  Clicked:1358  Download:2039  Cited:0  <Full Text>  <PPT> 319
Frontiers of Information Technology & Electronic Engineering  2023 Vol.24 No.12 P.1689-1707  DOI:10.1631/FITEE.2300490
4Reconfigurable intelligent surfaces for 6G: applications, challenges, and solutions
Author(s):Yajun ZHAO  Clicked:1297  Download:1340  Cited:0  <Full Text>  <PPT> 457
Frontiers of Information Technology & Electronic Engineering  2023 Vol.24 No.12 P.1669-1688  DOI:10.1631/FITEE.2200666
5XL-MIMO channel measurement,characterization,and Modeling for 6G:asurvey
Author(s):Pan TANG, Jianhua ZHANG, Haiyang MIAO, Qi WEI, Weirang ZUO,Lei TIAN, Tao JIANG, Guangyi LIU  Clicked:518  Download:285  Cited:0  <Full Text>
Frontiers of Information Technology & Electronic Engineering  In Press    DOI:
62-bit dual-polarized reconfigurable intelligent metasurface with low power consumption for 6G near-field communication
Author(s):Xiaowei CAO, Changjiang DENG, Youjia YIN, Yinan HAO, Weidong HU,Zhewei FU, Zhiji DENG  Clicked:149  Download:77  Cited:0  <Full Text>
Frontiers of Information Technology & Electronic Engineering  In Press    DOI:
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