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CLC number: TN821

On-line Access: 2024-03-25

Received: 2023-06-06

Revision Accepted: 2024-03-25

Crosschecked: 2023-10-11

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Citations:  Bibtex RefMan EndNote GB/T7714


Jiaguo LU


Haoran ZHU


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Frontiers of Information Technology & Electronic Engineering  2024 Vol.25 No.3 P.342-368


Engineering applications and technical challenges of active array microsystems

Author(s):  Jiaguo LU, Haoran ZHU

Affiliation(s):  East China Research Institute of Electronic Engineering, Hefei 230039, China; more

Corresponding email(s):   jglu@ustc.edu.cn, hrzhu86@gmail.com

Key Words:  Microelectronics, Heterogeneous integration, Packaging materials, Antenna array microsystems, Multi-functional radar, Communication

Jiaguo LU, Haoran ZHU. Engineering applications and technical challenges of active array microsystems[J]. Frontiers of Information Technology & Electronic Engineering, 2024, 25(3): 342-368.

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author="Jiaguo LU, Haoran ZHU",
journal="Frontiers of Information Technology & Electronic Engineering",
publisher="Zhejiang University Press & Springer",

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%T Engineering applications and technical challenges of active array microsystems
%A Jiaguo LU
%A Haoran ZHU
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%I Zhejiang University Press & Springer
%DOI 10.1631/FITEE.2300401

T1 - Engineering applications and technical challenges of active array microsystems
A1 - Jiaguo LU
A1 - Haoran ZHU
J0 - Frontiers of Information Technology & Electronic Engineering
VL - 25
IS - 3
SP - 342
EP - 368
%@ 2095-9184
Y1 - 2024
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/FITEE.2300401

In the post-Moore era, the development of active phased array antennas will inevitably trend towards active array microsystems. In this paper, the characteristics and composition of the active array antenna are briefly described. Owing to the high efficiency, low profile, and light weight of the active array microsystems, the application prospects and advantages in the engineering of multi-functional airborne radar, spaceborne radar, and communication systems are analyzed. Moreover, according to the characteristics of the post-Moore era of integrated circuits, scientific and technological problems in the active array microsystems are presented, including multi-scale, multi-signal, and multi-physics field coupling. The challenges are also discussed, such as new architectures and algorithms, miniaturization of passive components, novel materials and processes, ultra-wideband technology, and new interdisciplinary technological applications. This paper is expected to inspire in-depth research on active array microsystems.




Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article


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